Qualcomm, at the Mobile World Congress (MWC) 2025, has announced its 2025 lineup of products. The latest Snapdragon X85 5G modem is a successor to the Snapdragon X80 5G modem, and it will be used in smartphones and other devices.
On the other hand, the new Qualcomm Dragonwing platform is designed for businesses and industries with a use case in embedded IoT and cellular infrastructure. Here’s everything you need to know.
All you need to know about Snapdragon X85 5G
Qualcomm has announced its latest 5G modem, the Snapdragon X85 5G, which succeeds the Snapdragon X80 5G modem from last year. The new modem aims to deliver improved data speeds for downloads, uploads, and streaming.

The modem supports 5G and 5G Advanced features with peak upload speeds of 3.7 Gbps. It has dedicated tensor accelerator hardware, and it’s the first modem from the brand with bandwidth speeds of 400MHz. It supports mmWave 5G and mmWave-Sub 6 GHz.
The modem supports Turbo Dual SIM Dual Active (DSDA) with 3CC and 1CC, which is claimed to offer higher throughput in download and upload speeds. Qualcomm says that it plans to use this chipset in smartphones, compute, XR devices, wearables, gaming, and vehicles.
All you need to know about Qualcomm Dragonwing
Qualcomm also announced the new Dragonwing FWA Gen 4 Elite, which is advertised to be the world’s first 5G Advanced-capable Fixed Wireless Access (FWA) platform. The platform has up to 40 TOPs of NPU processing power. It offers optimised wireless connectivity across 5G and Wi-Fi.
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The Dragonwing FWA Gen 4 Elite platform supports long-range 5G mmWave performance, NTN satellite communication capabilities, and DSDA for high performance and aggregation. The platform has a quad-core processor with dedicated network accelerators for optimal performance across 5G cellular, Wi-Fi, and Ethernet.
The platform supports tri-band Wi-Fi 7 and up to 10Gigabit Ethernet speeds. It has Qualcomm’s latest X85 5G Modem-RF, which is set to deliver 5G downlink speeds of up to 12.5 Gbps. As for its usage, Qualcomm plans to ship the chipset later this year and its main use cases will be for cellular infrastructure and embedded IoT.

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Pranav Sawant
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